Failure Analysis
Root-Cause Failure Analysis
Connected Development’s failure analysis and RMA services deliver precise, expert support for identifying and resolving device failures. While many facilities focus solely on evaluation, our comprehensive failure analysis capabilities go farther: we can identify root causes and guide design improvements to prevent future failures.
Our state-of-the-art labs are fully equipped with the latest technology to make failure analysis fast, reliable, and actionable. Our wide range of on-site capabilities includes material analysis, X-ray inspection, PCB cross-sectioning, environmental testing, and more. Leveraging a highly skilled team and an 8D problem-solving approach, we provide thorough inspection processes that pinpoint the exact failure causes, enabling rapid, effective resolution and informed design enhancements.
Our Approach to Failure Analysis Includes:
X-Ray Imaging
High Magnification Imaging with Laser Induced Breakdown
Contamination/Residue Assessment
Spectroscopy Testing and Analysis
Circuit Board Cross Sectioning
Vibration Testing
Environmental Testing
Re-work Capabilities
8D Problem Solving Methodology and Reporting
Connected Development has an extensive suite of testing and RF equipment to ensure precise and efficient analysis. Our cutting-edge tools enable us to handle even the most complex failure analysis and testing needs.