Failure Analysis

Connected Development provides complete Failure Analysis and RMA handling services for our customers. Our labs are fully furnished with the latest in advanced technology equipment needed to analyze electronic device failures and determine root causes. We can perform material analysis, X-ray inspection, PCB Cross Sectioning, environmental testing and more on site. Our failure analysis team can inspect any returned product to drill down to specific root cause using our extensive equipment and a thorough 8D problem solving methodology.

Our approach to Failure Analysis includes:

• X-Ray Imaging
• High Magnification Imaging with Laser Induced Breakdown
• Contamination/ Residue Assessment
• Spectroscopy Testing and Analysis
• Circuit Board Cross Sectioning
• Vibration Testing
• Environmental Testing
• Re-work Capabilities
• 8D Problem Solving Methodology and Reporting